A chemical blend that forms a glue substance which is used to bond or join surfaces, or objects in electronics is known as electronic adhesives.
A major factor driving growth of the global electronic adhesives market is rapid development in semiconductor and electronics industry especially in Asia Pacific region. In addition, increasing demand for electronics adhesives from automotive sector is another factor driving growth of the global market. Major factors hampering growth of the global electronics adhesives market are volatility of raw material prices and stringent regulation related VOC.
On the basis of product, the global market is segmented into thermal conductive, electrically conductive, UV curing, and others. The electrically conductive segment accounted for highest share in the global market. The UV curing segment is expected to witness highest growth over the forecast period.
On the basis of application, the global market is segmented into surface mount devices, potting and encapsulation, conformal coatings, and others. The sulphur mount device segment accounts for highest revenue share in the global market and is expected to witness highest growth over the forecast period.
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On the basis of region, the global market is segmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The market in North America accounts for significant share in the global market. The Asia Pacific electronics adhesive market is expected to witness highest growth in terms of revenue over the forecast period. The growth can be attributed to presence of major consumer goods manufacturers in countries, coupled with rapid development in the semiconductor industry in this region.
Key players in the global market are BASF SE, H.B. Fuller, Henkel AG & Company, Alent PLC, Huntsman Corporation, Hitachi Chemicals, Dai Nippon Printing Co. Ltd., The Dow Chemical Co., Indium Corporation, Kyocera Chemical Corporation, Mitsui Chemicals Inc., The 3M Company, and other prominent players.